sfh 4239 ir-lumineszenzdiode (940 nm) mit hoher ausgangsleistung high power infrared emitter (940 nm) lead (pb) free produc t - rohs compliant vorl?ufige daten / preliminary data 2010-05-18 1 wesentliche merkmale ? max. gleichstrom 1 a ? niedriger w?rmewiderstand (9 k/w) ? schwerpunktswellenl?nge 940 nm ? esd-sicher bis 2 kv nach jesd22-a114-e ? erweiterte korrosionsfestigkeit (s.a. abschnitt ma?zeichnung) anwendungen ? infrarotbeleuchtung fr kameras ? berwachungssysteme ? fahrer-assistenz systeme ? beleuchtung fr bilderkennungssysteme sicherheitshinweise je nach betriebsart emi ttieren diese bauteile hochkonzentrierte, nicht sichtbare infrarot- strahlung, die gef?hrlich fr das menschliche auge sein kann. produkte, die diese bauteile enthalten, mssen gem?? den sicherheits- richtlinien der iec-normen 60825-1 und 62471 behandelt werden. typ type bestellnummer ordering code strahlst?rkegruppierung 1) ( i f = 1 a, t p = 100 s) radiant intensity grouping 1) i e (mw/sr) sfh 4239 q65110a9549 > 250 (typ. 550) 1) gemessen bei einem raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr features ? max. dc-current 1 a ? low thermal resistance (9 k/w) ? center of spectral emission at 940 nm ? esd safe up to 2 kv acc. to jesd22-a114-e ? superior corrosion robustness (see chapter package outlines) applications ? infrared illumination for cameras ? surveillance systems ? driver assistance systems ? machine vision systems safety advices depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. products which incorporate these devices have to follow the safety precautions given in iec 60825-1 and iec 62471.
2010-05-18 2 sfh 4239 grenzwerte ( t a = 25 c) maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebs- und lagertemperatur operating and storage temperature range t op , t stg ? 40 + 125 c sperrschichttemperatur junction temperature t j + 145 c sperrspannung reverse voltage v r 1 v vorw?rtsgleichstrom forward current i f 1 a sto?strom, t p < 200 s, d = 0 surge current i fsm 5 a leistungsaufnahme power consumption p tot 1.8 w w?rmewiderstand sperrschicht - l?tstelle thermal resistance junc tion - soldering point r thjs 9 k/w kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl?nge der strahlung wavelength at peak emission i f = 1 a, t p = 10 ms peak 950 nm centroid-wellenl?nge der strahlung centroid wavelength i f = 1 a, t p = 10 ms centroid 940 nm spektrale bandbreite bei 50% von i max spectral bandwidth at 50% of i max i f = 1 a, t p = 10 ms ? 35 nm abstrahlwinkel half angle ? 20 grad deg. aktive chipfl?che active chip area a 1 mm 2 abmessungen der aktiven chipfl?che dimension of the active chip area l b l w 1 1 mm2
sfh 4239 2010-05-18 3 schaltzeiten, i e von 10% auf 90% und von 90% auf 10%, i f = 5 a, r l = 50 switching times, e from 10% to 90% and from 90% to 10%, i f = 5 a, r l = 50 t r / t f 8 / 14 ns durchlassspannung forward voltage i f = 1 a, t p = 100 s i f = 5 a, t p = 100 s v f v f 1.4 (< 1.8) 2.0 (< 2.9) v v gesamtstrahlungsfluss total radiant flux i f = 1 a, t p = 100 s e 460 mw temperaturkoeffizient von i e bzw. e temperature coefficient of i e or e i f = 1 a, t p = 10 ms tc i ? 0.3 %/k temperaturkoeffizient von v f temperature coefficient of v f i f = 1 a, t p = 10 ms tc v ? 2 mv/k temperaturkoeffizient von temperature coefficient of i f = 1 a, t p = 10 ms tc , centroid + 0.3 nm/k kennwerte ( t a = 25 c) characteristics (cont?d) bezeichnung parameter symbol symbol wert value einheit unit
2010-05-18 4 sfh 4239 abstrahlcharakteristik radiation characteristics i rel = f ( ? ) strahlst?rke i e in achsrichtung 1) gemessen bei einem raumwinkel = 0.01 sr radiant intensity i e in axial direction at a solid angle of = 0.01 sr bezeichnung parameter symbol werte values einheit unit -cw -dw -ew strahlst?rke radiant intensity i f = 1 a, t p = 10 ms e min e max 250 500 400 800 630 1250 mw/sr mw/sr 1) nur eine gruppe in einer verpack ungseinheit (streuung kleiner 2:1) / only one group in one packing unit (variation lower 2:1) ohf04392 0? 20? 40? 60? 80? 100? 120? 0.4 0.6 0.8 1.0 100? 90? 80? 70? 60? 50? 0? 10? 20? 30? 40? 0 0.2 0.4 0.6 0.8 1.0 ?
sfh 4239 2010-05-18 5 relative spektrale emission relative spectral emission i rel = f ( ) max. zul?ssiger durchlassstrom max. permissible forward current i f = f ( t a ), r thjs = 9 k/w 800 0 nm % ohf04133 20 40 60 80 100 1050 850 900 950 i rel t i f a ohf04369 s 20 40 60 80 100 130 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.1 durchlassstrom forward current i f = f ( v f ) single pulse, t p = 100 s zul?ssige impulsbelastbarkeit permissible pulse handling capability i f = f ( t p ), t s = 85 c, duty cycle d = parameter ohf04405 f i v a 0 f v 10 -1 5 10 0 5 10 1 10 -2 0.5 1 1.5 2 2.5 0 -5 f i a t p s ohf04177 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 10 p t = d t t t p i f 0.01 0.33 0.5 0.2 0.1 0.02 d 0.005 = 0.05 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.5 1 relativer gesamtstrahlungsfluss relative total radiant flux e / e (1000ma) = f ( i f ) single pulse, t p = 100 s ohf04290 i f a 10 -1 510 0 510 1 1 10 -2 10 -3 10 5 10 10 5 -1 5 0 e (1 a) e 10 -2
2010-05-18 6 sfh 4239 ma?zeichnung package outlines ma?e in mm (inch) / di mensions in mm (inch). korrosionsfestigkeit besser als en 60068-2-60 (method 4): mit erweitertem korrosionstest: 40c / 90%rh / 15ppm h2s / 336h corrosion robustness better than en 60068-2-60 (method 4): with enhanced corrosion test: 40c / 90%rh / 15ppm h2s / 336h
sfh 4239 2010-05-18 7 empfohlenes l?tpaddesign recommended solder pad design ma?e in mm (inch) / dimensions in mm (inch) . solder resist bare copper freies kupfer l?tpasten schablone solder paste stencil l?tstopplack ohpy3638 1 (0.039) kupfer copper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 2.3 (0.091) 2.3 (0.091) 12.0 (0.472) 1.6 (0.063) 11.6 (0.457) 3 l?tstellen 3 solder points thermal enhanced pcb thermisch optimiertes pcb ?4.0 (0.157) heatsink attach ?4.0 (0.157) ?2.5 (0.098) 1 (0.039) footprint achtung: anode und heatsink sind elektrisch verbunden attention: anode and heatsink are electrically connected empfohlene padgeometrie recommended solder pad design
2010-05-18 8 sfh 4239 l?tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 reflow l?tprofil fr bleifreies l?ten (nach j-std-020c) reflow soldering profile for lead free soldering (acc. to j-std-020c) published by osram opto semico nductors gmbh leibnizstra?e 4, d-93055 regensburg www.osram-os.com ? all rights reserved. the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserv ed. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. packing please use the recycling operators known to you. we can also help you ? get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of tr ansport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or system s must be expressly authorized for such purpose! critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support de vice or system, or to affect its safety or effectiveness of that device or system. 2 life support devices or systems are intended (a) to be impl anted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. ohla0687 0 0 t t ?c s 120 s max 50 100 150 200 250 300 ramp up 100 s max 50 100 150 200 250 300 ramp down 6 k/s (max) 3 k/s (max) 25 ?c 30 s max 260 ?c +0 ?c -5 ?c 245 ?c 5 ?c 240 ?c 255 ?c 217 ?c maximum solder profile recommended solder profile 235 ?c -0 ?c +5 ?c minimum solder profile 10 s min anm.: das geh?use ist fr ultra schallreinigung nicht geeignet note: package not suitable for ultra sonic cleaning
mouser electronics related product links 720-SFH4239 - osram opto semiconductor sfh 4239
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